Prototype Inspection Day (PID) is approaching quickly, but we are not far from our final prototype design since we have been making major improvements to our capacitance sensor circuit and device functionality. As we get closer to the final design, the blog will, unfortunately, consist less of the circuit design since we still have to follow the NDA standards set by IPPD and Northrop Grumman.
This week, we presented our prototype architecture in front of the entire class. We received amazing feedback from classmates and plan to incorporate all suggestions to improve our architecture in the next report.
During our coach meeting this week, we were happy to have Dr. Mark Orazem in the meeting to clarify the possibility of electrical impedance as a detection method. After the discussion we had with Dr. Mark Orazem, we plan to continue developing our capacitance-sensing device because of potential issues with electrical impedance on semi-solid surfaces (in our case prepreg).
Next week, we plan on developing representative samples of curved composites with defects, 3D printing a couple of prototype casings, continuing to test the prototype’s detection reliability, and creating a poster board presentation for PID.