Blog Post #17

MATR Mechanical Engineering sub-team working on enclosure manufacturing process. (left to right) 3D printed mold for sensor package enclosure, mixing epoxy, pouring into mold.

MATR delivered their first Qualitative Review Board (QRB1) for the development of their prototype. The team was able to present the current status of their prototype development, as well as the current plans for completing the prototype. Updates on the current status included the successful ARGOS transmissions and what has been learned about the ARGOS satellite system through making transmissions and retrieving the data sent. One insight we gained is that the locations provided through telemetry are inconsistent and can be quite inaccurate, up to a few miles off, which confirmed that we will need to integrate a separate GPS module into the sensor package. An appropriate GPS module has since been ordered and is currently being shipped. Additionally, the enclosure manufacturing process was tested prior to delivering the presentation, and insights gained from that process were presented. The epoxy enclosure for the electronics was cast using the 3D printed mold according to plan, but the epoxy stuck to the mold, despite the use of a mold-release chemical specifically designed for the epoxy being used. The hardened epoxy was too stuck to be completely removed from the mold, so the team is planning to increase the density of the 3D printed mold among other measures to ensure the next iteration of the enclosure can be completely and easily removed from the mold once the epoxy cures. Positive insights on the enclosure manufacturing process include the transparency of the cured epoxy as well as its strength, giving the team confidence in being able to utilize ambient light sensors and safely protect electronics. Moving forward, electrical and computer engineers will work together to integrate all peripherals with the TI MSP430 microcontroller, and mechanicals will continue to develop the enclosure manufacturing process.

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