This week team FeraFree made more progress towards our sensor testing goals. The electrical side of the team evaluated available literature and determined that our use of breadboards up until now could be a major source of noise for the sensitive TMR component, diluting the signal quality obtained from debris particles in wind turbine bearing grease. As a result, the team plans to solder each component of the sensor data processing circuit together via a solder board next week. Hopefully this will reduce noise in the system and improve overall sensitivity. Expect images of that process or the new output data in the next blog update.
In response to the solder board revelation, the mechanical side of the team rapidly dimensioned (Eric and Diana shown doing this below) and designed a rigid support for the solder board and sample containers. Once printed, this part will reduce human error in testing and improve data reliability/repeatability as more variables come under the team’s control. On the microcontroller software front, Analog-to-Digital Conversion was programmed and implemented, allowing the microcontroller to interpret analog data from the sensor circuitry. Finally, the team drafted documentation for testing the sensor under a range of conditions in the near future.













