Returning from the Thanksgiving break, 3Delish has been prepping for our upcoming System Level Design Review. This past Tuesday, the team presented to a peer audience and has been since incorporating this feedback to polish our final presentation of the semester.

Some of the new changes implemented by the team include Caylynne’s re-design of the Extrusion Module to accommodate the printing of multiple materials and thermal components. Ian’s re-design of the Printhead Module also focuses on the incorporation of the multiple materials as well as temperature control via the heat cartridges and fan.

A priority for the team in the coming weeks will be the integration of these additional components in to the existing motherboard or via a capacity expansion board. There is also some designing required for the additional user inputs expected as a result of having 3 different materials to print. The user must then assign the materials and respective temperatures to the nozzle numbers in the user interface.

Stay tuned to see more of our build progress in the spring semester!