
Above is our preliminary design of the PCB. In the middle are two microprocessors and it will connect to a radar module.
We’ve been working hard on the radar device and the PCB is giving us unique challenges to solve. The first challenge is layer composition of our PCB. With high frequencies, we need a special material to maintain signal integrity. This material is a Rogers RO3003 and many fabrication companies don’t support this material because it needs advanced processing. Thus, we need to start emailing advanced manufacturers to get a quote that’s hopefully within our budget. Furthermore, our design contains eight layers that adds to the complexity.
The second challenge is tolerances, each connection in our design needs to be validated by a fabricator early enough to prevent design revisions due to inadequate specifications. This makes reaching out imperative to prevent redesign.
The final challenge is interference, with a completed board it can disrupt cellphone communication. Thus, we need to consider certain design elements to minimize interference. When the prototype is complete, we will test it for interference.
That is all for this week, more will be posted next week!









