Blog Post #19

First successfully manufactured epoxy device enclosure.

This week the electrical and computer engineering teams made progress on the system integration. Writing programs for communication between the microcontroller and peripheral ICs. This will allow them to move forward with integrating the specific components and conduct testing next week. Meanwhile, the mechanical team has been able to make improvements to the enclosure manufacturing process. The hardened epoxy has now be successfully removed from the 3D printed mold. There is still room for improving the process when it comes to removing the epoxy easily, and further testing is being done to determine the ideal method. Now that an enclosure has been obtained, the team can move forward with waterproof testing to meet the technical performance measure for the device reliability specifications for the prototype. Also, electrical and mechanical engineers are working together to incrementally improve the enclosure design as the electrical system evolves through the system integration process. In other news, a date of March 1st has been set for the team’s visit to the Northrop Grumman facility in Melbourne. Team MATR is communicating with Northrop Grumman liaisons and IPPD faculty to sort out the logistics and ensure the trip goes smoothly.

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